STC’s foundry provides customers unmatched fabrication capabilities and flexibility for both 150mm and 200mm substrates – including silicon, SOI, quartz, glass, metal and polyimides.
Our extensive packaging services include strengths in wafer level packaging and 3-D integration at the device and wafer levels for micro- and optoelectronic technologies.
In order to maintain strict quality controls, STC utilizes state-of-the-art optical, in-line, and scanning electron microscopy to ensure manufacturability.
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